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Samsung creates 8GB DDR3 DRAM using 3D-TSV technology

December 7, 2010 By Kunal Gangar Leave a Comment

  Samsung has developed a new 8GB RDIMM memory module using three-dimensional (3D) chip stacking technology. The stacking technology which is also known as ‘through silicon via’ (TSV) helps to save up to 40 percent of power as compared to a conventional RDIMM module whereas at the same time increase the DRAM density by more […]

Filed Under: Hardware

Samsung creates a 0.6mm thick 32GB memory chip

November 4, 2009 By Samsung Hub Leave a Comment

  Samsung has developed the world’s thinnest multi-die memory package that is just 0.6mm thick and packs a whopping 32GB of storage. The new memory package is 40 percent thinner and lighter compared to the conventional memory packages stacked with eight chips. The ultra-thin package consists of eight dies (chips) of 4GB NAND flash that […]

Filed Under: Hardware, Technology

Toshiba launches first 32nm NAND flash memory

April 27, 2009 By Apurva Leave a Comment

Toshiba has announced to ship its high density NAND flash chips fabricated with 32nm technology soon. Samples of 32nm based 16Gb (2GB) and 32Gb (4GB) flash chips are available now which can be used to integrate in memory cards, USB drives and other embedded products. The 32Gb chip will first be applied to memory card, […]

Filed Under: Gadgets, Hardware

Samsung Flex-OneNAND memory will get 40nm treatment

March 10, 2009 By Samsung Hub Leave a Comment

  Samsung continues its innovations for the Flex-OneNAND fusion memory chip. They will now be using 40nm process technology to produce 8Gb (Gigabit) Flex-OneNAND memory. Flex-OneNAND is a fusion of SLC and MLC NAND in a single silicon chip. With the help of the bundled software, the user can optimize the portion of SLC and […]

Filed Under: Hardware

SanDisk, Toshiba flaunts X3, X4 flash memory technology

February 12, 2009 By Apurva 2 Comments

  SanDisk and Toshiba have been collaborating for quite some time to develop flash technologies. The latest breakthrough by them are the 43nm X4 and 32nm X3 flash chips, currently showcased at the International Solid State Circuits Conference (ISSCC). The 32nm 32Gb X3 flash chip is the smallest NAND flash in the industry and is […]

Filed Under: Technology

SanDisk comes out with 16GB microSDHC and M2 cards

September 30, 2008 By Kunal Gangar 1 Comment

  SanDisk recently announced the 16GB microSDHC and M2 cards. These boast the world’s largest capacity tag in its class and in fact SanDisk is the first one to produce a M2 card with such capacity. The cards will start retailing from next month at Best Buy outlets for $100 (microSDHC) and $130 (M2). Press […]

Filed Under: Misc.

Sony and SanDisk announce 16GB CF card

September 23, 2008 By Kunal Gangar Leave a Comment

  Sony’s Recording Energy & Media division and SanDisk reveal their 16GB CF storage card which can write at a speed of 45mbps. Both the cards are a perfect match for UDMA cameras which are 12.5 percent faster compared to current UDMA CF cards. The price of Sony’s 16GB CF card is unknown but will […]

Filed Under: Misc., PMP

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